Liu Haijun，Dong Zhigang,Huang Han,Kang Renke,Zhou Ping，A new method for measuring the flatness of large and thin silicon substrates using a liquid immersion technique:Measurement Science and Technology,2015

Liu Haijun,Zhu Xianglong,Kang Renke,Dong Zhigang,Chen Xiuyi，Three-point-support method based on position determination of supports and wafers to eliminate gravity-induced deflection of wafers:Precision Engineering,2016,46):339-348.

Liu Haijun，Han Jiang,Tian Xiaoqing,Dong Fangfang,Chen Shan,Lu Lei，Accurate determination of bifurcation points for ground silicon wafers considering anisotropy using FEM method:Materials Research Express,2019,6(9

Liu Haijun，Zhou Jing,Tian Xiaoqing,Han Jiang,Chen Shan,Lu Lei，Evaluation of polishing-induced subsurface damage based on residual stress distribution via measured global surface deformation for thinned silicon wafers:Surface Topography: Metrology and Properties,2021,9(3