- Ying Lin，Silicone encapsulants with high thermal stability for SiC power devices under high temperatures:Journal of Materials Science: Materials in Electronics
- 1. Lin Y., Dong L., Heng C., et al. Coupling relationship between molecule structure at silica/silicone gel interfaces and ionic conductivity in polymer composites. Composites Science and Technology. 2024, 110507.（1区TOP期刊，SCI检索，第一作者）
- 2. Lin Y., Liu Y., Wu K., et al. Dynamic electrical conductivity induced by isothermal crystallization in aluminum hydroxide filled silicone rubber. Applied Physics Letters. 2021,119: 152902.（2区TOP期刊，SCI检索，第一作者）
- 3. Lin Y., Zhang Y., Liu Y., et al. Temperature- and Degradation- Dependent Maximum Electric Field Stress in Wire-bonding Power Modules under PWM Waves. IEEE Journal of Emerging and Selected Topics in Power Electronics. 2022, 10(6): 7653-7664.（1区TOP期刊，SCI检索，第一作者）
- 4. Lin Y., Liu Y., Wu K., et al. Crystal structure dependent tensile properties of silicone rubber: Influence of aluminium hydroxide. Polymer Testing. 2022, 113: 107679. （2区TOP期刊，SCI检索，第一作者）
- 5. Lin Y., Liu Y., Cao B., et al. Effect of multiphase content on temperature dependent electrical conductivity in silicone rubber composites. High Voltage. 2022, 8(2): 283-292.（1区TOP期刊，SCI检索，第一作者）
- 6. Liu Y., Lin Y.*, Zhang Y.*, et al. Understanding Water Diffusion Behaviors in Epoxy Resin through Molecular Simulations and Experiments. Langmuir. 2024. （2区TOP期刊，封面论文，SCI检索，第一通讯作者）
- 7. Liu Y., Lin Y.*, Cao B., et al. Enhancement of polysiloxane/epoxy resin compatibility through an electrostatic and van der Waals potential design strategy, Polymer Testing, 2023, 117: 107820.（2区TOP期刊，SCI检索，第一通讯作者）
- 8. Liu Y., Lin Y.*, Wang Y., et al. Simultaneously improving toughness and hydrophobic properties of cycloaliphatic epoxy resin through silicone prepolymer. Journal of Applied Polymer Science. 2022, 139: e52478. (封面论文，SCI检索，第一通讯作者)
- 9. Lin Y., Wu K., Liu Y., et al. Dielectric spectroscopy of aluminium hydroxide particles filled silicone rubber and dielectric model analysis with modified numerical solutions. Journal of Physics D: Applied Physics. 2020, 53: 275303. （SCI检索，第一作者）