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Scientific Research
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Paper Publications
more+- [1] Ying Lin，Silicone encapsulants with high thermal stability for SiC power devices under high temperatures:Journal of Materials Science: Materials in Electronics
- [2] 1. Lin Y., Dong L., Heng C., et al. Coupling relationship between molecule structure at silica/silicone gel interfaces and ionic conductivity in polymer composites. Composites Science and Technology. 2024, 110507.（1区TOP期刊，SCI检索，第一作者）
- [3] 2. Lin Y., Liu Y., Wu K., et al. Dynamic electrical conductivity induced by isothermal crystallization in aluminum hydroxide filled silicone rubber. Applied Physics Letters. 2021,119: 152902.（2区TOP期刊，SCI检索，第一作者）
- [4] 3. Lin Y., Zhang Y., Liu Y., et al. Temperature- and Degradation- Dependent Maximum Electric Field Stress in Wire-bonding Power Modules under PWM Waves. IEEE Journal of Emerging and Selected Topics in Power Electronics. 2022, 10(6): 7653-7664.（1区TOP期刊，SCI检索，第一作者）
- [5] 4. Lin Y., Liu Y., Wu K., et al. Crystal structure dependent tensile properties of silicone rubber: Influence of aluminium hydroxide. Polymer Testing. 2022, 113: 107679. （2区TOP期刊，SCI检索，第一作者）
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Ying Lin
Date of Birth:1993-09-11
Gender:Female
Education Level:With Certificate of Graduation for Doctorate Study
Alma Mater:清华大学电机系
Degree:Doctoral degree
Status:Employed
School/Department:电气工程系
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