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Silicone encapsulants with high thermal stability for SiC power devices under high temperatures

Release time:2024-12-12 Hits:

Journal:Journal of Materials Science: Materials in Electronics

First Author:Ying Lin

Translation or Not:no

Included Journals:SCI

Next One:1. Lin Y., Dong L., Heng C., et al. Coupling relationship between molecule structure at silica/silicone gel interfaces and ionic conductivity in polymer composites. Composites Science and Technology. 2024, 110507.（1区TOP期刊，SCI检索，第一作者）

Ying Lin

Date of Birth:1993-09-11 Gender:Female Education Level:With Certificate of Graduation for Doctorate Study Alma Mater:清华大学电机系 Degree:Doctoral degree Status:Employed School/Department:电气工程系 E-Mail:

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