Ying Lin，Silicone encapsulants with high thermal stability for SiC power devices under high temperatures:Journal of Materials Science: Materials in Electronics

1. Lin Y., Dong L., Heng C., et al. Coupling relationship between molecule structure at silica/silicone gel interfaces and ionic conductivity in polymer composites. Composites Science and Technology. 2024, 110507.（1区TOP期刊，SCI检索，第一作者）

2. Lin Y., Liu Y., Wu K., et al. Dynamic electrical conductivity induced by isothermal crystallization in aluminum hydroxide filled silicone rubber. Applied Physics Letters. 2021,119: 152902.（2区TOP期刊，SCI检索，第一作者）

3. Lin Y., Zhang Y., Liu Y., et al. Temperature- and Degradation- Dependent Maximum Electric Field Stress in Wire-bonding Power Modules under PWM Waves. IEEE Journal of Emerging and Selected Topics in Power Electronics. 2022, 10(6): 7653-7664.（1区TOP期刊，SCI检索，第一作者）

4. Lin Y., Liu Y., Wu K., et al. Crystal structure dependent tensile properties of silicone rubber: Influence of aluminium hydroxide. Polymer Testing. 2022, 113: 107679. （2区TOP期刊，SCI检索，第一作者）

5. Lin Y., Liu Y., Cao B., et al. Effect of multiphase content on temperature dependent electrical conductivity in silicone rubber composites. High Voltage. 2022, 8(2): 283-292.（1区TOP期刊，SCI检索，第一作者）

6. Liu Y., Lin Y.*, Zhang Y.*, et al. Understanding Water Diffusion Behaviors in Epoxy Resin through Molecular Simulations and Experiments. Langmuir. 2024. （2区TOP期刊，封面论文，SCI检索，第一通讯作者）

7. Liu Y., Lin Y.*, Cao B., et al. Enhancement of polysiloxane/epoxy resin compatibility through an electrostatic and van der Waals potential design strategy, Polymer Testing, 2023, 117: 107820.（2区TOP期刊，SCI检索，第一通讯作者）

8. Liu Y., Lin Y.*, Wang Y., et al. Simultaneously improving toughness and hydrophobic properties of cycloaliphatic epoxy resin through silicone prepolymer. Journal of Applied Polymer Science. 2022, 139: e52478. (封面论文，SCI检索，第一通讯作者)

9. Lin Y., Wu K., Liu Y., et al. Dielectric spectroscopy of aluminium hydroxide particles filled silicone rubber and dielectric model analysis with modified numerical solutions. Journal of Physics D: Applied Physics. 2020, 53: 275303. （SCI检索，第一作者）