Xueting Dai , Zhongyue Huang*, Yuan Yu , Chongjian Zhou , Fangqiu Zu. Effect of Electroless Plating with Cu Content on Thermoelectric and Mechanical Properties of p-type Bi0.5Sb1.5Te3 Bulk Alloys. Journal of Materials Science-Materials in Electronics. 2019, 30: 15018–15023.
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