|
-
功率半导体器件封装、可靠性、测试和失效分析
- 功率器件功率循环测试技术的挑战与分析
- Power Cycling Method for Power Modules With Low Thermal Resistance
- Influence of power cycling ageing on the current and voltage transitions during hard switching of IGBT devices
- Investigations on Averaging Mechanisms of Virtual Junction Temperature Determined by V-CE(T) Method for IGBTs
- Research on the Multiphysics Field-Circuit Coupling Model ofPress Pack IGBT Considering the Application of Hybrid HVDC Breakers
- Sequential V-ce(T) Method for the Accurate Measurement of Junction Temperature DistributionWithin Press-Pack IGBTs