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- 功率器件功率循环测试技术的挑战与分析
- Power Cycling Method for Power Modules With Low Thermal Resistance
- Influence of power cycling ageing on the current and voltage transitions during hard switching of IGBT devices
- Investigations on Averaging Mechanisms of Virtual Junction Temperature Determined by V-CE(T) Method for IGBTs
- Research on the Multiphysics Field-Circuit Coupling Model ofPress Pack IGBT Considering the Application of Hybrid HVDC Breakers
- Sequential V-ce(T) Method for the Accurate Measurement of Junction Temperature DistributionWithin Press-Pack IGBTs
- Correction of Delay-Time-Induced Maximum Junction Temperature Offset During Electrothermal Characterization of IGBT Devices
- Temperature Influence on the Accuracy of the Transient Dual Interface Method for the Junction-to-Case Thermal Resistance Measurement
- Study on the Method to Measure Thermal Contact Resistance Within Press Pack IGBTs
- Study on the Method to Measure the Junction-to-Case Thermal Resistance of Press-Pack IGBTs
- Influence of Temperature on the Pressure Distribution Within Press Pack IGBTs
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