Dr. Shuibao Liang is an Associate Professor at Hefei University of Technology. He is mainly engaged in the research works related to the microstructural characteristics and reliability of interconnection structures in microelectronics manufacturing and electronic packaging under multi physical loads. Dr Liang participated in a number of National Natural Science Foundation of China and Engineering and Physical Sciences Research Council (EPSRC, UK) projects, he has published more than 30 academic papers as the first author in the fields of materials science, microelectronics reliability, and applied physics, and won the Best Student Paper Award and the Outstanding Paper Award at the international conferences about electronic components and packaging reliability. 

Research Interests

Electronic packaging

Reliability analysis of electronic products

Surfaces and interfaces of electronics interconnects

Power electronics

Electronics for harsh environments

Microelectronics manufacturing process simulation

Education Background

2013 – 2019, South China University of Technology , Doctor of Engineering

2017 – 2018, Loughborough University, Joint PhD. student

Work Experience

2023 – Present, Hefei University of Technology, Associate Professor

2019– 2022, Loughborough University, Researcher

Contact

E-mail: s.liang@hfut DOT edu DOT cn

Publications

Since 2020

(1)        S. Liang, X.P. Zhang. Unraveling the electric field effect on the grain‐boundary migration in alumina through phase field modeling. Journal of the American Ceramic Society 2023, 106(3): 1647-1652.

(2)        S. Liang, C. Wei, A. Kunwar, U. Subedi, H. Jiang, H. Ma, et al. Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing. Surfaces and Interfaces 2023: 102728.

(3)        F. Vogel, J. Cheng, S. Liang, C. Ke, S. Cao, X.P. Zhang, et al. Formation and evolution of hierarchical microstructures in a Ni-based superalloy investigated by in situ high-temperature synchrotron X-ray diffraction. Journal of Alloys and Compounds 2022, 919: 165845.

(4)        S. Ramachandran, Y. Zhong, S. Robertson, C. Panteli, S. Liang, F. Wu, et al. Fast in-situ synchrotron X-ray imaging of the interfacial reaction during self-propagating exothermic reactive bonding. Materialia 2022, 23: 101444.

(5)        C. Liu, A. Liu, H. Jiang, S. Liang, Z. Zhou, C. Liu. Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging. Microelectronics Reliability 2022, 138: 114688.

(6)        S. Liang, M. Zhou, C. Ke, C. Wei, X.P. Zhang. Study of migration and coalescence of voids driven by electric current stressing in solder interconnects using phase field simulation. Microelectronics Reliability 2022, 138: 114611.

(7)        S. Liang, Y. Zhong, S. Robertson, A. Liu, H. Jiang, C. Liu, et al. Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding. Microelectronics Reliability 2022, 138: 114654.

(8)        S. Liang, C. Wei, C. Ke, S. Cao, M. Zhou, X.P. Zhang. Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via. IEEE Transactions on Device and Materials Reliability 2022, 22(2): 267-275.

(9)        S. Liang, C. Liu, Z. Zhou. Phase field study of grain boundary migration and preferential growth in non-magnetic materials under magnetic field. Materials Today Communications 2022, 31: 103408.

(10)      S. Liang, A. Kunwar, C. Liu, H. Jiang, Z. Zhou. Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation. Journal of Materials Research and Technology 2022, 19: 345-353.

(11)      H. Jiang, S. Robertson, S. Liang, Z. Zhou, L. Zhao, C. Liu. Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer. Microelectronics Reliability 2022, 138: 114681.

(12)      H. Jiang, S. Robertson, S. Liang, Z. Zhou, L. Zhao, C. Liu. Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array. Materials Letters 2022, 307: 131074.

(13)      H. Jiang, S. Robertson, S. Liang, Z. Zhou, L. Zhao, C. Liu. Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite. Materials Today Communications 2022, 33: 104623.

(14)      H. Jiang, S. Liang, C. Wei, C. Ke. Phase field modelling of the electromigration behaviour in sintered silver. Journal of Materials Research 2022, 37(14): 2322-2334.

(15)      S. Liang, Y. Zhong, S. Robertson, A. Liu, Z. Zhou, C. Liu. Thermo-mechanical characteristics and reliability of die-attach through self-propagating exothermic reaction bonding. IEEE Transactions on Components, Packaging and Manufacturing Technology 2021, 11(12): 2122-2129.

(16)      S. Liang, C. Wei, C. Ke. Effect of anisotropy in thermal conductivity on grain boundary migration under temperature gradient–A phase field study. Materials Letters 2021, 303: 130517.

(17)      S. Liang, A. Kunwar, C. Wei, C. Ke. Insight into the preferential grain growth of intermetallics under electric current stressing–A phase field modeling. Scripta Materialia 2021, 203: 114071.

(18)      C. Wei, C. Ke, S. Liang, S. Cao, H. Ma, X. Zhang. An improved phase field method by using statistical learning theory-based optimization algorithm for simulation of martensitic transformation in NiTi alloy. Computational Materials Science 2020, 172: 109292.

(19)      S. Liang, Y. Zhong, S. Robertson, A. Liu, Z. Zhou, C. Liu. Investigation of thermo-mechanical and phase-change behavior in the Sn/Cu interconnects during self-propagating exothermic reaction bonding.  Proceedings of 70th Electronic Components and Technology Conference (ECTC); IEEE; 2020. p. 269-275.

More details about the rencent research works, please vist the personal academic homepage:  https://websliang.github.io/

(Updated in March 2023)