Hits:

DOI number:10.1002/anie.201804054

Journal:Angewandte Chemie International Edition

Co-author:Bang Wang,Jianbo He

First Author:Yongfei Li,Lei Song

Correspondence Author:Yulin Li,Zhaoxiang Deng,Chenge Mao

Volume:57

Issue:23

Page Number:6892-6895

Translation or Not:no

Date of Publication:2018-06-04

Pre One:Ag Ion Soldering: An Emerging Tool for Sub-nanomeric Plasmon Coupling and Beyond Next One:“Flash” preparation of strongly coupled metal nanoparticle clusters with sub-nm gaps by Ag+ soldering: toward effective plasmonic tuning of solution-assembled nanomaterials”