Language : English
李育林

Paper Publications

Ag Ion Soldering: An Emerging Tool for Sub-nanomeric Plasmon Coupling and Beyond

Hits:

DOI number:10.1021/acs.accounts.9b00463

Journal:Accounts of Chemical Research

First Author:Yulin Li

Correspondence Author:Zhaoxiang Deng

Volume:52

Issue:12

Page Number:3442-3454

Translation or Not:no

Date of Publication:2019-11-19