功率器件功率循环测试技术的挑战与分析

Power Cycling Method for Power Modules With Low Thermal Resistance

Influence of power cycling ageing on the current and voltage transitions during hard switching of IGBT devices

Investigations on Averaging Mechanisms of Virtual Junction Temperature Determined by V-CE(T) Method for IGBTs

Research on the Multiphysics Field-Circuit Coupling Model ofPress Pack IGBT Considering the Application of Hybrid HVDC Breakers

Sequential V-ce(T) Method for the Accurate Measurement of Junction Temperature DistributionWithin Press-Pack IGBTs

Correction of Delay-Time-Induced Maximum Junction Temperature Offset During Electrothermal Characterization of IGBT Devices

Temperature Influence on the Accuracy of the Transient Dual Interface Method for the Junction-to-Case Thermal Resistance Measurement

Study on the Method to Measure Thermal Contact Resistance Within Press Pack IGBTs

Study on the Method to Measure the Junction-to-Case Thermal Resistance of Press-Pack IGBTs