Silicone encapsulants with high thermal stability for SiC power devices under high temperatures
点击次数：
发表刊物：Journal of Materials Science: Materials in Electronics
是否译文：否
收录刊物：SCI
上一条： Decoupling of interfacial ionic diffusion from segmental dynamics in silica filled silicone gel through experiments
下一条： 1. Lin Y., Dong L., Heng C., et al. Coupling relationship between molecule structure at silica/silicone gel interfaces and ionic conductivity in polymer composites. Composites Science and Technology. 2024, 110507.（1区TOP期刊，SCI检索，第一作者）