Paper Publications

Thermo-hygroscopic-mechanical coupling simulation method for power electronics under power cycling test

Release time:2026/04/23

Hits:

Journal:: IEEE Transactions on Power Electronics

Translation or Not:: no

Pre One:An alternative junction-to-case thermal resistance test method for high power press-pack IGBTs
Next One:Power coupling analysis and improved decoupling control for the VSC connected to a weak AC grid

Contact us: No. 193, Tunxi Road, Hefei City, Anhui Province (230009) Post Code: 230009
Copyright © 2019 Hefei University of Technology
Anhui Public Network Security No. 34011102000080 Anhui ICP No. 05018251-1

PostalAddress：

QR code