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2. 高性能非开挖管道修复材料关键技术研究（企业合作，W2022JSKF1006）；
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Pre One:
1. 半导体光刻胶和封装材料核心原料的关键技术研究（企业合作，W2023JSKF1006）；
Next One:
3. 环保型光引发剂的应用开发（企业委托，W2020JSKF0763）；
