CN

宋奎晶

Associate researcher

Supervisor of Master's Candidates

Date of Birth:1986-10-03

Date of Employment:2016-05-23

School/Department:材料成型及控制工程系

Education Level:With Certificate of Graduation for Doctorate Study

Business Address:材料科学与工程学院南附楼305

Gender:Female

Degree:Doctoral degree

Status:Employed

Academic Titles:中国机械工程学会计算机辅助焊接专委会委员、中国机械工程学会焊接青委会委员、国家自然科学基金项目通讯评审专家、教育部学位中心论文评审专家、多省科技管理信息系统项目评审专家、中国有色金属学会有色金属智库认证专家、安徽省焊接学会理事兼副秘书长、焊接杂志社青年编委

Alma Mater:哈尔滨工业大学

Discipline:Material Process Engineering

Paper Publications

Microstructure and mechanical properties of spark plasma diffusion-bonded 5A06Al joints with Al-20Cu-5Si-2Ni interlayer

Release time:2024-04-29 Hits:

Journal:International Journal of Advanced Manufacturing Technology

Key Words:Spark plasma diffusion bonding 5A06Al alloy Al-20Cu-5Si-2Ni Accelerated atomic diffusion Tensile strength

Abstract:Spark plasma diffusion welding (SPDW) is a powerful technique for joining materials at a remarkably short time with excellent quality. In this paper, SPDW of 5A06Al alloy to itself was conducted with Al–20Cu–5Si–2Ni brazing filler alloy added as the interlayer. In the bonding temperature ranging from 520 to 550°C, pressure from 0.3 to 6 MPa, and holding time from 10 to 20 min, the optimal joint was obtained at bonding temperature of 540°C and pressure of 6 MPa for 10 min. Results showed that the void-free 5A06Al/5A06Al-bonded joint was obtained at the optimized parameters with the aiding of electric current and Al–20Cu–5Si–2Ni interlayer. Increasing the bonding pressure produced more refined grains in the bonding joint and was therefore beneficial to the bonding quality. The formation of refined eutectic phases, the accelerated atomic diffusion, the sufficiently removal of oxide film, and the evidently more narrowed bonding interface areas were helpful to strengthen the SPDW joint. The most efficient bonding joint had a tensile strength of as high as 220 MPa and exhibited typical fine ductile dimple fractography. Comparatively, the poorest joint quality was obtained at lower bonding temperature and pressure, i.e., bonding temperature of 530°C, pressure of 0.3 MPa, and holding time of 10 min.

Co-author:Lei Lv,Shuai Zhu,Fei Liu,Junrui Luo,Zhenhua Qing,Zhihong Zhong,Zhixiong Zhu,Yucheng Wu

First Author:Kuijing Song

Indexed by:Journal paper

Discipline:Engineering

Document Type:J

Issue:114

Page Number:3627-3643

Translation or Not:no

Date of Publication:2021-08-04

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