Paper Publications
Release time: 2026-05-08Hits:
- Translation or Not:no
- Pre One:[16] Linfeng Gao, Xianfen Li, Peng Hua, Meng Wang & Wei Zhou. Nickel interlayer on the microstructure and property of TC6 to copper alloy diffusion bonding. Journal of Adhesion Science and Technology, 2018 32(14), 1548-1559
- Next One:[18] Xianfen Li，Fei Zhang，Fangqiu Zu，Xue Lv，et al. Effect of liquid-liquid structure transition on solidification and wettability of Sn-0.7Cu solder, Journal of Alloys and Compounds. 2010 505, 472-475
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Doctoral Degree in Engineering
李先芬
MOBILE Version