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刘雪鹏
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电子器件封装力学、芯片晶圆减薄力学机理、纳米晶超晶格形成机理及复杂力学行为、非均质层状金属和高熵合金强韧化设计、金属材料辐照效应

电子器件封装力学、芯片晶圆减薄力学机理、纳米晶超晶格形成机理及复杂力学行为、非均质层状金属和高熵合金强韧化设计、金属材料辐照效应