Temperature- and Degradation-Dependent Maximum Electric Field Stress in Wire-Bonding Power Modules Under PWM Waves
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影响因子：5.462
DOI码：10.1109/JESTPE.2022.3195177
发表刊物：IEEE Journal of Emerging and Selected Topics in Power Electronics
论文类型：期刊论文
是否译文：否
发表时间：2022-12-01
收录刊物：SCI