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Home > Scientific Research > Patents

Thermal Modeling Method of Magnetic Coupler in Inductive Power Transfer Applications

Release time:2026-03-21 Hits:

Affilication of Author(s):香港城市大学
 Type of Patent:PCT or foreign applications
 State of Patent:Pending patent
 Application Number:19/384,059
 Service Invention or Not:no
 Application Date:2025-10-11

Next One:一种无线充电系统磁耦合器参数设计方法和相关设备

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