Patents
Release time: 2026-06-02Hits:
- Patent Applicant:邹亦轩,沈荣华,朱辉,张云鹏,高冲,余承勇,李恩,谢春茂,张薇,李兴兴
- Type of Patent:Invent
- State of Patent:Authorized patents
- Authorization number:ZL202211562683.0
- Service Invention or Not:no
- Application Date:2022-12-07
- Authorization Date:2026-04-28
- First Author:高勇
- Pre One:基于终端短路法的微波平板材料电磁参数测试系统及方法
- Next One:低频微波电场作用下低损材料毫米波介电测试系统及方法
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Doctoral Degree in Engineering
高勇


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