人工智能、下一代芯片体系结构、3D芯片与Chiplet、集成电路可测性设计；基于脑电波与生理信号的人机交互系统、情感计算。

部分相关论文：

1. Tian Chen, Lubao Li, Xiaohui Yuan. A Graph Neural Network with Spatial Attention for Emotion Analysis. Cognitive Computation, 2025, 17(3). https://doi.org/10.1007/s12559-024-10358-1.

2.  Xianrui Dou, Huaguo Liang, Zhengfeng Huang and Maoxiang Yi, Yingchun Lu, Tian Chen, Maoxiang Yi. Pulse-Based Prebond TSV Testing. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 2025, https://doi.org/10.1109/TVLSI.2025.3534862.

3. Junming Li, Huaguo Liang, Hao Lv, Yuqi Pan, Zhengfeng Huang, Tian Chen, Yingchun Lu.  Machine Learning-Based Diagnosis of Defects in 2.5D and 3D Interconnects. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2025, https://doi.org/10.1109/TCPMT.2025.3550201.

4.  Chen Tian, Ruiyuan Ding, Liu Jun, Xiaohui Yuan, Yingchun Lu, Huaguo Liang, Siyuan Liu. A Scan-Chain-Based Built-in Self-Test for ILV in Monolithic 3-D ICs. IEEE Transactions on Instrumentation and Measurement. 2024,73: 1-13 

5. Jun Liu, Songren Cheng, Tian Chen, Xi Wu, Huaguo Liang. A Self-Biased Current Reference Source-Based Pre-Bond TSV Test Solution. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 2024, 32(4): 774-781.

6. Jun Liu, Zhi Chen, Songren Cheng, Chen Xiang, Tian Chen, Xi Wu, Yingchun Lu, Huaguo Liang. A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method. IEEE Transactions on Instrumentation and Measurement. 73: 1-10 (2024)

7. Jun Liu, Zhi Chen, Tian Chen, Xi Wu, Huaguo Liang, Xiaohui Yuan. Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs. IEEE Trans. Circuits Syst. II Express Briefs 2024, 71(8): 3930-3934.

8.   陈田, 蔡从虎,袁晓辉,罗蓓蓓.基于多尺度卷积和自注意力特征融合的多模态情感识别方法. 计算机应用, 2024,44(2): 369-376.

9. Zhinan Qiao, Xiaohui Yuan, Runmei Zhang, Tian Chen, Chaoning Zhang. Efficient deep-narrow residual networks using dilated pooling for scene recognition. Expert Systems with Applications. 2023, 234,121018.

10. Chen Tian, Jianyong Lu, Liu Jun, Huaguo Liang, YingchunLu, MaoxiangYi. A reconfigurable test method based on LFSR for 3D stacking integrated circuits, Integration-the VLSI Journal 2022 87(11): 82-89.

11. Tian Chen, Hongfang Yin, Xiaohui Yuan, Yu Gu, Fuji Ren, Xiao Sun. Emotion Recognition based on Fusion of Long Short-Term Memory Networks and SVMs. Digital Signal Processing, 2021, 117(10), 103153.

12. Tian Chen, Sihang Ju, Fuji Ren, Mingyan Fan, Yu Gu. EEG emotion recognition model based on the LIBSVM classifier. Measurement, 2020, 164(11): 108047.

13. Tian Chen, Yongsheng zuo, Xin An, Fuji Ren. A variable‑length compatible compression scheme based on tristate signals. Journal of Supercomputing, 2020, 76(2): 1020–1033.

14.  Chen Tian, Ju Sihang, Yuan Xiaohui, Elhoseny Mohamed, Ren Fuji, Fan Mingyan, Chen Zhangang. Emotion recognition using empirical mode decomposition and approximation entropy. Computers and Electrical Engineering, 2018, 72(11): 383-392.

15. Tian Chen, Chenxin Lin, Huaguo Liang, Fuji Ren. A Dictionary-Based Test Data Compression Method Using Tri-State Coding, 2018 IEEE 27th Asian Test Symposium.

16.   陈田，汪加伟，安鑫，任福继. 三维芯片层间与核间并行测试调度优化方法.计算机应用， 2018, 38(6): 1795-1880.

17. 陈田, 易鑫, 王伟, 刘军, 梁华国, 任福继. 一种低功耗双重测试数据压缩方法.电子学报，2017，45(6)：1382-1388. 

18. Tian Chen, D Shen, X Yi, H Liang, X Wen, W Wang. Reseeding-oriented Test Power Reduction for Linear-Decompression-Based Test Compression Architectures. IEICE Transactions on Information and Systems, 2016, 99(11):2672-2681.

19. 陈田，易鑫，郑浏旸，王伟，梁华国，任福继，刘军. 基于Viterbi的低功耗确定性测试方案. 计算机辅助设计与图形学学报，2016，28（05）:821-829. 

20. 陈田，梁华国, 王伟, 易茂祥, 黄正峰. 基于优化编码的LFSR重播种测试压缩方案.计算机研究与发展，2012，49（2）:443-452.